Process Overview

This automation solution uses two Yaskawa robots with pneumatic grippers to handle semiconductor sputter carriers and automate the sand blasting process.

Due to the long shape and heavy weight of the workpiece, the handling task previously required two operators, and the workplace environment was harsh due to dust generated during the sanding process.

By automating the entire workflow from handling to sanding through robotic automation, the solution unmanned the key process and significantly improved the operator working environment.